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Main > Application > Sample problems

PCB thermal analysis

Problem Type:
3D problem of heat transfer.

Geometry:

pcb scheme

Given:

Item

Loss [W]

Volume [cm3]

CPU

2.5

4.62

IC

0.5

1.1

LM317

0.5

0.28

470 uF

0.2

2.26

1500 uF

0.15

0.8

Transformer

0.4

2.74

Diode

0.1

0.064

L1

0.1

2.08

FR4 board thermal conductivity λ = 0.25 W/K·m;
Radiator board thermal conductivity λ = 200 W/K·m;
Elements thermal conductivity λ = 1 W/K·m;
Convection coefficient α = 12 W/K·m2;

Problem:
Calculate the temperature distribution in a printed circuit board.

Solution:
QuickField takes losses values in [W/m3], so the ratio of loss [W] to volume [m3] from the table above is specified (for example, for CPU it is 2.5/4.62e-6).

Results:

pcb temperature distribution

Video

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