**Problem Type:**

3D problem of heat transfer.

**Geometry:**

All length units are in millimeters.

**Given:**

Thermal conductivity of metal λ = 270 W/K·m.

Convection coefficient α = 10 W/(K·m^{2}).

Chip heat flux *Q* = 10 W.

**Problem:**

Calculate radiator thermal resistance.

**Solution:**

Thermal resistance is the ratio of *Temperature difference* to *Heat flux*. As the *heat flux* is input parameter, QuickField task is to calculate the temperature distribution.

QuickField takes an input heat flux as watts per meter square [W/m^{2}]. So we should divide *Q* [W] by the chip surface area (which is 20mm x 20mm = 0.004 m^{2}).

**Results:**

Temperature distribution in the heat sink:

See the *chip_radiator_heat_sink.pbm* problem in the Examples folder.