**Problem Type:**

3D problem of heat transfer.

**Geometry:**

**Given:**

Item |
Loss [W] |
Volume [cm |

CPU |
2.5 |
4.62 |

IC |
0.5 |
1.1 |

LM317 |
0.5 |
0.28 |

470 uF |
0.2 |
2.26 |

1500 uF |
0.15 |
0.8 |

Transformer |
0.4 |
2.74 |

Diode |
0.1 |
0.064 |

L1 |
0.1 |
2.08 |

FR4 board thermal conductivity λ = 0.25 W/K·m;

Radiator board thermal conductivity λ = 200 W/K·m;

Elements thermal conductivity λ = 1 W/K·m;

Convection coefficient α = 12 W/K·m^{2};

**Problem:**

Calculate the temperature distribution in a printed circuit board.

**Solution:**

QuickField takes losses values in [W/m^{3}], so the ratio of loss [W] to volume [m^{3}] from the table above is specified (for example, for CPU it is 2.5/4.62e-6).

**Results:**

See the *pcb_temperature.pbm* problem in the Examples folder.