Problem Type:
3D problem of heat transfer.
Geometry:
Given:
| Item | Loss [W] | Volume [cm3] |
| CPU | 2.5 | 4.62 |
| IC | 0.5 | 1.1 |
| LM317 | 0.5 | 0.28 |
| 470 uF | 0.2 | 2.26 |
| 1500 uF | 0.15 | 0.8 |
| Transformer | 0.4 | 2.74 |
| Diode | 0.1 | 0.064 |
| L1 | 0.1 | 2.08 |
FR4 board thermal conductivity λ = 0.25 W/K·m;
Radiator board thermal conductivity λ = 200 W/K·m;
Elements thermal conductivity λ = 1 W/K·m;
Convection coefficient α = 12 W/K·m2;
Problem:
Calculate the temperature distribution in a printed circuit board.
Solution:
QuickField takes losses values in [W/m3], so the ratio of loss [W] to volume [m3] from the table above is specified (for example, for CPU it is 2.5/4.62e-6).
Results:
See the pcb_temperature.pbm problem in the Examples folder.