Thermal analysis plays an important role in design of many different mechanical and electrical systems. Generally the quantities of interest in thermal analysis are temperature distribution, thermal gradients, and heat losses.
QuickField can perform linear and nonlinear thermal analysis for 2D models (plane or axisymmetrical) and 3D models. The program is based on heat conduction equation with convection and radiation boundary conditions. Following options are available for thermal analysis:
Material properties: orthotropic materials with constant thermal conductivity, isotropic temperature dependent conductivities.
Loading sources: constant and temperature dependent volume heat densities, convective and radiative sources, Joule heat sources imported from DC or AC conduction or AC or transient magnetic analysis.
Boundary conditions: prescribed temperatures, boundary heat flows, convection, radiation, and prescribed constraints for constant temperature boundaries.
Postprocessing results: temperatures, thermal gradients, heat flux densities, and total heat losses or gains on a given part.
Special features: a postprocessing calculator is available for evaluating user-defined integrals on given curves and surfaces. Plate models with varying thickness can be used for thermal analysis. The temperatures can be used for thermal stress analysis (thermo-structural coupling) or as initial state for transient problem.
3D analysis limitations: current QuickField version does not support anisotropic materials, non-linear dependencies (dependence of the thermal conductivity or volume power of the heat source from the temperature), radiation boundary condition, transient analysis and coupled problems.
Related Topics
Heat transfer formulation in Theoretical Description
3D Heat transfer formulation in Theoretical Description
Heat transfer examples