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Main >> Applications >> Sample problems

Chip radiator heat sink - QuickField simulation example

Engineering question

How to calculate radiator thermal resistance?

Answer
Thermal resistance may be calculated as the ratio of the temperature difference to the heat flux obtained from a 3D thermal model.

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Typical applications
electronic heat sinks, PCB cooling structures, semiconductor heat spreaders

Chip radiator heat sink

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Simulation problem

Problem Type
3D problem of heat transfer.

Geometry
All length units are in millimeters.
Chip radiator heat sink Calculate radiator thermal resistance. Radiator 20 20 43 40 10 30 4 1 2 6 1

Given
Thermal conductivity of metal λ = 270 W/K-m.
Convection coefficient α = 15 W/(K·m²).
Ambient air temperature T0 = 20 °C.
Chip heat flux Q = 10 W.

Task
Calculate radiator thermal resistance.

Solution
Thermal resistance is the ratio of Temperature difference to Heat flux. As the heat flux is an input parameter, QuickField task is to calculate the temperature distribution.
QuickField takes an input heat flux as watts per meter square [W/m²]. So we should divide Q [W] by the chip surface area (which is 20mm x 20mm = 0.0004 m²).

Results
Temperature distribution in the heat sink:
Thermal resistance of a chip heat sink from its steady-state temperature rise under a 10 W heat load, including natural convection to ambient air.

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