FEA solving module, magnetics, electrostatics, conduction, heat transfer, stress analysis, electric circuit
QuickField is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis. It combines a family of analysis modules using the latest solver technology with a very user-friendly model editor (preprocessor) and a powerful postprocessor.
QuickField requires no training - you may start using it as soon as it is installed on your computer, without knowing the mathematical algorithms used and details of their implementation.
QuickField is a native Windows® application, which was designed for this platform only. It fully utilizes the advantages of a modern operational environment. It is very compact, yet powerful, and can be used for many design applications.
QuickField may be ordered in different analysis configurations. Each package is equipped with model editor (preprocessor), data editors, solvers and postprocessors. Types of solvers, data editors and postprocessors depend on the analysis options included, and full selection of options is listed below.
|Electrostatics (2D & 3D)
DC Conduction (2D & 3D)
Transient Electric Field
|Thermal and Stress analysis|
|Steady-state Heat transfer (2D & 3D)
Transient Heat transfer
See also: list of new features introduced in the latest QuickField version.