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Main >> Product >> Packages >> Heat transfer analysis

The **Heat Transfer** module is used to analyze the temperature distribution in static and transient heat transfer processes. The heat sources in the **Heat Transfer** module can be specified directly and/or imported from other QuickField problems (coupled problems) as Joule Losses.

The **Heat Transfer** module can be used to design and analyze many different electrical and mechanical systems.

Starting from version 6.2 steady-state heat transfer analysis is possible not only in 2D Plane-Parallel and 2D axisymmetrical formulations, but also as a 3D Extrusion and 3D Import.

**Features of the Heat Transfer module:**

- Steady-state or transient formulation with arbitrary initial field distribution, nonlinear specific heat and flexible time parameters
- Nonlinear or anisotropic properties
- Distributed and concentrated heat sources
- Heat sources as a function of temperature
- Heat sources generated by electric power losses
- Boundary temperature and heat fluxes
- Boundary conditions with convective/radiative terms
- Results: various ways of thermal field mapping (temperature, heat flux, thermal gradients), total heat loss on any given part, and other integral quantities
- Couplings: the resulting temperatures can be used for thermal stress analysis in both steady-state and transient cases. Transient heat transfer problem may be based on the results of other steady-state or transient problem.

Building thermal insulation simulation with QuickField

transient heating of a slot

heat transfer in the capacity kiln

inductively heated ceramics

heat transfer in cylinder

temperature distribution in the conducting sheet

PCB heating

Natural convection from the horizontal tube surface