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Heat Transfer

heat transfer analysis, heat source, thermal analysis, generated heat, temperature distribution analysis

The Heat Transfer module is used to analyze the temperature distribution in static and transient heat transfer processes. The heat sources in the Heat Transfer module can be specified directly and/or imported from other QuickField problems (coupled problems) as Joule Losses.
The Heat Transfer module can be used to design and analyze many different electrical and mechanical systems.

Starting from version 6.2 steady-state heat transfer analysis is possible not only in 2D Plane-Parallel and 2D axisymmetrical formulations, but also as a 3D Extrusion and 3D Import.

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Transient heating of a slot

Heat transfer in the capacity kiln

Inductively heated ceramics

Heat transfer in a cylinder

Temperature distribution in the conducting sheet

PCB heating

ISO 10077-2:2012 Frames thermal  transmittance

Natural convection from the horizontal tube surface

PCB heating

Casserole pan thermal losses

Outside chimney temperature

Thermal conduction Fourier

Multilayer coated pipe

ISO 10211:2007 Thermal bridges

PCB thermal analysis

Local Over-Heat Model in SF6 GIS

Equilibrium temperature

Labview: water heater control system

Temperature response of a suddenly cooled wire

Transient temperature distribution in an orthotropic metal bar

Cylinder with temperature dependent conductivity

Features of the Heat Transfer module:

  • Video: Thermal engineering with QuickField
    Building thermal insulation simulation with QuickField
  • See examples of Heat Transfer problems:
    transient heating of a slot
    heat transfer in the capacity kiln
    inductively heated ceramics
    heat transfer in cylinder
    temperature distribution in the conducting sheet
    PCB heating
    Natural convection from the horizontal tube surface

    + More examples...

    New version QuickField 6.4