Thermal conductivity of the composite material

QuickField simulation example

PCB consists of two layers: FR4 dielectric and a copper foil. Dielectric and copper feature different thermal conductivity.

Problem Type
Plane-parallel problem of heat transfer.

Geometry

Given
Thermal conductivity of copper is 380 W/K-m;
Thermal conductivity of FR4 dielectric is 0.25 W/K-m;

Task
Calculate effective thermal conductivity of a printed circuit board.

Solution
Thermal conductance = (Heat flux / Temperature difference) * ( Path length / Cross-section area ).
Path length is measured along the heat flux. Cross-section area is measured in the plane across the heat flux.

We apply temperature difference and QuickField calculates the heat flux.

Results

• Download simulation files (files may be viewed using any QuickField Edition).