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MEMS stress sensor

MEMS stress sensor simulation, MEMS capacitance, microelectromechanical systems

MEMS sensor changes its shape under mechanical stress. The electrode plates come close and the variation in electrical capacitance is detected.

Problem type:
Plane-parallel problem of electrostatics and stress analysis .

Geometry:
MEMS stress sensor Microelectromechanical system sensor changes its shape under mechanical stress Silicon Copper Copper Force 20μ 14μ

Given:

Young's
modulus
Poisson's
ratio
Silicon 130 GPa 0.1
Copper 140 GPa 0.34

Task:
Calculate the sensor deformation and electrical capacitance in initial and deformed states.

Solution:
Initially the electrostatic problem is simulated to calculate the native capacitance of the sensor.
Then deformed sensor profile is calculated in stress analysis problem. The profile is exported into the separate geometry model file using Stress Deform tool. That deformed shape model is then used to run another electrostatic analysis to calculate the deformed state capacitance.

Results:
Initial capacitance value 0.0026 pF
Capacitance in deformed state 0.0028 pF (+10%)

Electric field distribution in the deformed stress sensor
Electric field distribution in the deformed stress sensor


Calculation of deformed shape using QuickField Stress Analysis module.

Translation of the deformed shape to the geometry model using the StressDeform tool

Initial capacitance calculation using Electrostatics module.

Deformed state capacitance calculation
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