Microphone PCB thermal analysis
QuickField simulation example
Problem Type
3D problem of heat transfer.
Geometry
Given
| Item | Loss [W] | Volume [mm³] |
| Chip | 0.1 | 126 |
| R1 (1 Ohm) | 0.1² * 1 | 1.22 |
| R2 | 0.1² * 1 | 1.22 |
| R3 | 0.1² * 1 | 1.22 |
| R4 | 0.1² * 1 | 1.22 |
| C1 | 0.01 | 63 |
| Microphone | 0.01 | 326 |
FR4 board thermal conductivity λ = 0.3 W/K-m;
Elements thermal conductivity λ = 1 W/K-m;
Convection coefficient α = 5 W/K-m²;
Task
Calculate the temperature distribution in a printed circuit board, which is specified in a STEP file exported from a CAD program.
Solution
QuickField takes losses density values in [W/m³], so the ratio of loss [W] to volume [m³] from the table above is specified (for example, for the chip it is 0.1/126e-9).
Results
Temperature distribution in a printed circuit board.
- Video: Microphone PCB thermal analysis. Watch on YouTube
- Download simulation files (files may be viewed using any QuickField Edition).