QuickField

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PCB thermal analysis

QuickField simulation example

Problem Type
3D problem of heat transfer.

Geometry
pcb scheme

Given

Item Loss [W] Volume [cm³]
CPU 2.5 4.62
IC 0.5 1.1
LM317 0.5 0.28
470 uF 0.2 2.26
1500 uF 0.15 0.8
Transformer 0.4 2.74
Diode 0.1 0.064
L1 0.1 2.08

FR4 board thermal conductivity λ = 0.25 W/K-m;
Radiator board thermal conductivity λ = 200 W/K-m;
Elements thermal conductivity λ = 1 W/K-m;
Convection coefficient α = 12 W/K-m²;

Task
Calculate the temperature distribution in a printed circuit board.

Solution
QuickField takes losses values in [W/m³], so the ratio of loss [W] to volume [m³] from the table above is specified (for example, for CPU it is 2.5/4.62e-6).

Results
pcb temperature distribution