PCB thermal analysis - QuickField simulation example
Engineering question
How to calculate the temperature distribution in a printed circuit board?
Answer
Assign each component loss as volumetric heat generation, apply the board and component thermal conductivities and convection, and solve the 3D steady-state temperature distribution.
Typical applications
printed circuit boards, electronic assemblies, component mounting boards
Download
- Download simulation files (files may be viewed using any QuickField Edition).
Simulation problem
Problem Type3D problem of heat transfer.
Geometry
Given
| Item | Loss [W] | Volume [cm³] |
| CPU | 2.5 | 4.62 |
| IC | 0.5 | 1.1 |
| LM317 | 0.5 | 0.28 |
| 470 uF | 0.2 | 2.26 |
| 1500 uF | 0.15 | 0.8 |
| Transformer | 0.4 | 2.74 |
| Diode | 0.1 | 0.064 |
| L1 | 0.1 | 2.08 |
FR4 board thermal conductivity λ = 0.25 W/K-m;
Radiator board thermal conductivity λ = 200 W/K-m;
Elements thermal conductivity λ = 1 W/K-m;
Convection coefficient α = 12 W/K-m²;
Task
Calculate the temperature distribution in a printed circuit board.
Solution
QuickField takes losses values in [W/m³], so the ratio of loss [W] to volume [m³] from the table above is specified (for example, for CPU it is 2.5/4.62e-6).
Results
Video
- PCB thermal analysis. Watch on YouTube