Thermal contact resistance*

Thermal contact resistance is the ratio of temperature drop across an interface between two contacting bodies to the heat flow rate through this interface. It depends on surface roughness, contact pressure, material properties, and presence of interface layers.

Thermal contact resistance is important for analysis of electronic packages, heat sinks, layered structures, bolted joints, thermal interfaces.

In QuickField, thermal contact resistance can be analysed by evaluating temperature distribution and heat flux through contacting surfaces using Static Heat Transfer or Transient Heat Transfer packages. The temperature drop across the interface and the corresponding heat flow rate allow estimating thermal contact resistance.

References

Wikipedia: Thermal contact conductance
ScienceDirect Topics: Contact thermal resistance

QuickField examples

Chip radiator heat sink
Shallow foundation thermal resistance
Thermal conductivity of the composite material

^* We do not guarantee that articles in the section "Glossary" are full and exact, and may be used as a reference of any kind. In fact - they are not! These are just informal hints, letting the students and amateurs better understand what is the specific term about. Experts should not read it at all! However, we will appreciate all expert recommendations about improving and extending our glossary.